Fedv-343 (QUICK)

Reference data came from a stationary weather station (Vaisala) and manual GC-MS sampling. Each FEDV-343 logged data every 5 minutes over 60 days.

(You can replace the simple ASCII diagram with a proper graphic in your final layout.) fedv-343

FEDV‑343 delivers in its class while providing a full ISP and industrial temperature tolerance —features that many competitors lack. Reference data came from a stationary weather station

+-------------------+ +-------------------+ +-------------------+ | Camera Sensors | | External Memory | | Network I/O | | (MIPI‑CSI‑2) | | (eMMC/SSD) | | (10GbE/USB‑4) | +--------+----------+ +--------+----------+ +--------+----------+ | | | v v v +-------------------+ +-------------------+ +-------------------+ | Image Signal | | On‑Chip SRAM | | PCIe / USB‑4 | | Processor (ISP) | | & eDRAM Cache | | Interface | +--------+----------+ +--------+----------+ +--------+----------+ | | | v v v +---------------------------------------------------------------+ | FEDV‑343 Compute Engine (8×MAC Arrays) | | Mixed‑precision (4‑/8‑/16‑bit) AI accelerator + Security | +---------------------------------------------------------------+ | v +-------------------+ +-------------------+ | Host Processor | | Power Manager | | (ARM Cortex‑A78) | | (DVFS, Gating) | +-------------------+ +-------------------+ Three units were deployed at two test sites:

FEDV‑343 is a next‑generation designed for real‑time computer‑vision inference at the edge. Built on a 7 nm silicon‑photonic‑enhanced ASIC, it delivers up to 12 TOPS (tera‑operations‑per‑second) while consuming less than 1.8 W under full load. The platform targets autonomous systems, smart‑city infrastructure, industrial robotics, and advanced AR/VR devices that require ultra‑low latency, high‑throughput visual AI without reliance on cloud connectivity.

Three units were deployed at two test sites:

| Competitor | Peak TOPS | Power (W) | Process | Unique Feature | |------------|-----------|-----------|---------|----------------| | | 11 | 10 | 12 nm | GPU + Tensor Cores | | Google Edge TPU | 4 | 2 | 28 nm | Google‑optimized ops | | Intel Movidius Myriad X | 3.5 | 0.9 | 22 nm | VPU with dedicated vision ISP | | FEDV‑343 | 12 | ≤ 1.8 | 7 nm | Integrated silicon‑photonic interconnect + industrial‑grade temperature range |